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Chip Fuses
CC06H Series High I2t 0603 Size Fuse
Features
* * * * * * * *
HF FREE
HALOGEN
Pb
Halogen free High inrush withstand capability Fast-acting performance RoHS compliant Lead free Ampacity alpha mark on fuse for easy identification Standard termination design for easy solderability Compatible with standard lead-free solder reflow and wave soldering processes * Excellent environmental integrity
Applications
For secondary protection in space constrained applications such as:
Surface Mount Device
Electrical Characteristics
Amp Rating 1-5A 1-5A 1-5A Description
The ChipTM CC06H Series high I t fuse is a very small surface mount fuse (0603 size) designed to protect low voltage circuits from the harmful effects of short-circuits. The technology of this series combines the robust Cooper Bussmann(R) solid matrix fuse construction with advanced fuse element design to deliver state-of-the-art overcurrent protection on circuits subject to inrush currents.
2
% of Amp Rating 100 200 250
Opening Time 4 Hours 1-60 Seconds 5 Seconds Maximum
* * * * *
LCD backlight inverters Digital cameras DVD players Bluetooth headsets Battery packs
(R)
Agency Information
*
C US
Recognized Card: (1A-5A) Guide JDXY2, File E19180
Part Numbering System: CC06H 1A -TR
Fuse Series Amp Rating Packaging Code Suffix
Packaging
* TR - Packaging code suffix for tape-and-reel (8mm wide tape on 178mm diameter reel - specification EIA 481-1) * Quantity = 5000 fuses
Specifications
Catalog Amp Number Rating5 CC06H1A 1 CC06H1.5A 1.5 CC06H2A 2 CC06H2.5A 2.5 CC06H3A 3 CC06H3.5A 3.5 CC06H4A 4 CC06H5A 5 Alpha Marking B H K L O R S T Voltage Interrupting Typical Rating Vdc Rating (amps)1, 4 Resistance ()2 32 50 0.225 32 50 0.122 32 50 0.061 32 50 0.045 32 50 0.027 32 50 0.021 32 50 0.018 32 50 0.013 Typical Melt I2t3 0.02 0.07 0.20 0.25 0.30 0.60 1 2 Typical Typical Voltage Drop (V) Power Loss (W) 0.295 0.30 0.220 0.33 0.160 0.32 0.145 0.36 0.110 0.33 0.100 0.35 0.100 0.40 0.088 0.44 Agency Approvals cRUus x x x x x x x x
1. DC Interrupting Rating (measured at rated voltage, time constant of less than 50 microseconds, battery source). 2. DC Cold Resistance are measured at <10% of rated current in ambient temperature of 20C FOR REFERENCE ONLY - CONTROLLED VALUES HELD BY PLANT AND SUBJECT TO CHANGE WITHOUT NOTICE. 3. Typical Pre-arching I2t are measured at 10In current.
4. The insulation resistance after breaking capacity test is higher than 0.1M when measured by 2X rated voltage. 5. Device designed to carry rated current for 4 hours minimum. An operating current 80% or less of rated current is recommended, with further design derating required at elevated ambient temperature. See Temperature Derating Curve on next page.
0609
BU-SB09345
Page 1 of 4
Data Sheet 4346
Time-Current Curves
100 1A 1 .5A 10 2A 3A 3 .5 A 4A 2 .5 A 5A
Melting I2t Curves
100
10
Average Melting Time (seconds)
1
0 .1
Melting I t
2
1
0 .0 1
0 .1
0 .0 0 1
0 .0 0 0 1 1 10 100
Current (amps)
0 .0 1 0 .0 0 0 0 1
0 .0 0 0 1
0 .0 0 1
0 .0 1
0 .1
1
10
Time (seconds)
Temperature Derating Curve
Construction
Amp Rating Alpha Code Fused Green Glass Cover
End Termination White Ceramic Substrate
1 = Silver termination pad 2 = Green fused glass cover 3 = Alpha code marking 4 = End termination: A) Nickel underplate - 200 to 400 microinches B) 100% Tin plate - 300 to 600 microinches 5 = Metal film fusible element 6 = White ceramic substrate
0609
BU-SB09345
Page 2 of 4
Data Sheet 4363
Dimensions - mm (in)
Recommended Pad Layout - mm (in)
1.25 (0.05)
1.60 0.15 (0.063 0.006)
0.81 0.15 (0.032 0.006)
0.50 (0.02)
0.90 (0.035)
0.35 0.15 (0.014 0.006) 0.47 0.08 (0.0185 0.003)
Product Characteristics
Operating Temperature Storage Temperature Load Humidity Moisture Resistance Thermal Shock Vibration Test Mechanical Shock Resistance Salt Spray Resistance Insulation Resistance Solderability Resistance to Soldering Heat High Temperature Life Test Board Flex Test Terminal Strength Resistance to Solvents -40C to 85C , with proper derating factor applied -40C to 85C MIL-STD-202G, Method 103B (1000 hr @ 85C / 85% RH & 10% rated current) MIL-STD-202, Method 106E (50 cycles) MIL-STD-202, Method 107D (-65C to +125C, 100 cycles) MIL-STD-202, Method 204D, Test Condition D (10-2,000Hz) MIL-STD-202, Method 213B (3000G / 0.3ms) MIL-STD-202, Method 101, Test Condition B (48 hr exposure) The insulation resistance after breaking capacity test is higher than 0.1M when measured by 2X rated voltage J-STD-002C Method B1 (Dip and Look Test), Method G1 (Wetting Balance Test), Method D (Resistance to Dissolution / Dewetting of Metalization) MIL-STD-202, Method 210F (Solder dip - 260C, 60 seconds / Solder Iron - 350C, 3-5 seconds) MIL-STD-202G, Method 108A (1000 Hours @ 70C & 60% rated current) AEC-Q200 Method 005 (2mm deflection for 60 seconds) AEC-Q200 Method 006 (5N force for 60 seconds) MIL-STD-202, Method 215K
0609
BU-SB09345
Page 3 of 4
Data Sheet 4346
Solder Reflow Profile
TP TC -5C Max. Ramp Up Rate = 3C/s Max. Ramp Down Rate = 6C/s TL Preheat A t tP
Table 1 - Standard SnPb Solder (T c)
Package Thickness <2.5mm _ >2.5mm Volume mm3 <350 235C 220C Volume mm3 _ >350 220C 220C
Temperature
T smax
Table 2 - Lead (Pb) Free Solder (T c)
Tsmin ts
Package Thickness <1.6mm 1.6 - 2.5mm >2.5mm
Time
Volume mm3 <350 260C 260C 250C
Volume mm3 350 - 2000 260C 250C 245C
Volume mm3 >2000 260C 245C 245C
25C
Time 25C to Peak
Manual solder (rework only): solder tip 350C maximum, 5 seconds maximum.
Reference JDEC J-STD-020D
Profile Feature Preheat and Soak * Temperature min. (Tsmin) * Temperature max. (Tsmax) * Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25C to Peak Temperature Standard SnPb Solder 100C 150C 60-120 Seconds 3C/ Second Max. 183C 60-150 Seconds Table 1 20 Seconds** 6C/ Second Max. 6 Minutes Max. Lead (Pb) Free Solder 150C 200C 60-120 Seconds 3C/ Second Max. 217C 60-150 Seconds Table 2 30 Seconds** 6C/ Second Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
(c) 2009 Cooper Bussmann St. Louis, MO 63178 www.cooperbussmann.com
0609
BU-SB09345
Page 4 of 4
Data Sheet 4346

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